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 HRV103A
Silicon Schottky Barrier Diode for Rectifying
REJ03G0398-0100 Rev.1.00 Oct 12, 2004
Features
* Low forward voltage drop and suitable for high efficiency rectifying. * Thin Ultra small Resin Package (TURP) is suitable for high density surface mounting and high speed assembly.
Ordering Information
Type No. HRV103A Laser Mark S1 Package Code TURP
Pin Arrangement
Cathode mark Mark 1
S1
2 1. Cathode 2. Anode
Rev.1.00 Oct 12, 2004 page 1 of 5
HRV103A
Absolute Maximum Ratings
(Ta = 25C)
Item Repetitive peak reverse voltage Reverse voltage Average rectified current Non-Repetitive peak forward surge current Junction temperature Symbol VRRM VR 2 IO * IFSM * Tj
1
Value 30 30 1 5 125
Unit V V A A C C
Storage temperature Tstg -55 to +125 Notes: 1. 10ms sine wave 1 pulse 2. Ta = 44C, With Ceramics board (board size: 50mm x 50 mm, Land size 2mm x 2 mm) Short form wave (180C), VR = 10 V.
Electrical Characteristics
(Ta = 25C)
Item Forward voltage Symbol VF1 Min Typ Max 0.27 0.36 0.42 100 1000 40 -- A pF C/W Unit V Test Condition IF = 100 mA IF = 700 mA IF = 1 A, VR = 5 V VR = 30 V VR = 10 V, f = 1 MHz 1 Ceramics board * Glass epoxy board *
2
--
-- -- -- -- -- -- --
--
-- -- -- -- -- 100 200
Reverse current Capacitance Thermal resistance
VF2 VF3 IR1 IR2 C
Rth(j-a)
Notes: 1. Ceramics board
2.0
0.5
2.0 0.3 2.0
50hx50wx0.8t
Unit: mm
1.0
2. Glass epoxy board
6.0
0.5
6.0 0.3 2.0
50hx50wx0.8t
Unit: mm
1.0
3. TURP is the structure which radiates heat to a substrate, please perform mounting to a substrate by reflow.
Rev.1.00 Oct 12, 2004 page 2 of 5
HRV103A
Main Characteristics
1.0
Ta = 75C
10-1 Pulse test
Ta = 25C
Pulse test 10-2
Reverse current IR (A)
Ta = 75C
10-1
Forward current IF (A)
10-2
10-3
Ta = 25C
10-3
10-4
10-4
10-5
10-5
10-6
0
0.2
0.4
0.6
0.8
1.0
10-6
0
10
20
30
40
Forward voltage VF (V) Fig.1 Forward current vs. Forward voltage
Reverse voltage VR (V) Fig.2 Reverse current vs. Reverse voltage
f=1MHz Pulse test 100
Capacitance C (pF)
10
1.0 0.1
1.0 Reverse voltage VR (V)
10
Fig.3 Capacitance vs. Reverse voltage
Rev.1.00 Oct 12, 2004 page 3 of 5
HRV103A
0.8
Reverse power dissipation Pd (W)
8
0V D=5/6 t T Tj = 125C t D=-- T D=1/3 0A t T t D=-- T D=1/6 sin(=180) D=1/3
Forward power dissipation Pd (W)
0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0
7 6 5 4 3 2 1 0 0
Tj = 25C
D=1/2 DC
D=1/2
sin(=180)
0.5
1.0
1.5
10
20
30
40
Forward current IF (A) Fig.4 Forward power dissipation vs. Forward current 1.2
Reverse voltage VR (V) Fig.5 Reverse power dissipation vs. Reverse voltage
Average rectified current IO (A)
1.0
VR=VRRM/3 Tj =125C Rth(j-a)=100C/W DC
0.8
D=1/2 sin(=180)
0.6
D=1/3 D=1/6
0.4
0.2
0 -25
0
25
50
75
100
125
Ambient temperature Ta (C) Fig.6 Average rectified current vs. Ambient temperature
Rev.1.00 Oct 12, 2004 page 4 of 5
HRV103A
Package Dimensions
Unit: mm
0.80 0.05
2.50 0.10
0.13 0.05
0.55 Max
0.20 1.25 + 0.10 -
1.90 0.1
0.60 0.05
Package Code JEDEC JEITA Mass (reference value)
TURP -- -- 0.004 g
Rev.1.00 Oct 12, 2004 page 5 of 5
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
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(c) 2004. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .2.0


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